COMPUTE + COOLING

Built for High-Density AI Compute

Modern AI infrastructure demands new rack densities, new cooling methods, and new facility logic. This page makes that transition legible.

AT A GLANCE

Purpose-Built Infrastructure

100+kW Per Rack Density
<1.1 PUE Target
480VDC Power Distribution

THE GAP

Why Legacy Facilities Break Down

Traditional data centers were designed for general-purpose compute at 5-15 kW per rack. Air cooling, raised floors, and perimeter CRAC units worked well for that era. But modern AI workloads push rack densities to 50-100+ kW. At these levels, air cooling hits fundamental physical limits.

Retrofit attempts are expensive and often insufficient. New AI infrastructure requires a clean-sheet approach to power delivery, cooling architecture, and physical layout.

DENSITY

Rack Density Evolution

Configuration	Rack Density	Cooling	PUE	Power Model
Traditional	5-10 kW	Air (CRAC)	1.4-1.8	Grid
Cloud Optimized	15-30 kW	Hot/Cold Aisle	1.2-1.4	Grid + PPA
GPU-Dense	40-70 kW	Rear-door Liquid	1.15-1.3	Grid + PPA
Nexus Model	100+ kW	Full Immersion	<1.1	Nuclear + Renewable

MODULAR DESIGN

Modular Pod Architecture

Rather than building monolithic facilities, the infrastructure is organized into self-contained pods. Each pod is a deployable unit with defined inputs and outputs that can be factory-assembled and rapidly deployed on site.

50-100 racks Compute Pod
MW-scale Cooling Pod
100G+ Network Pod

COOLING

Three-Tier Cooling Architecture

Tier 1

Direct-to-Chip Liquid

Cold plates mounted directly on processors remove heat at the source. Most efficient approach for hotspot management with minimal thermal resistance.

Tier 2

Single-Phase Immersion

Servers fully submerged in dielectric fluid. Eliminates air cooling entirely and enables uniform heat removal across all components.

Tier 3

Two-Phase Immersion

Fluid boils at the chip surface, vapor rises and condenses, then returns to the bath. Highest density capability with passive fluid circulation.